Replacing a smart ring's charging IC — a wafer-level package — a technician grips it exactly as they grip molded BGAs: tweezers firm on the package edges, a thumb brace against the top face while positioning. What does the section correct?

Select one answer.

• Only the brace — edge grip is fine on any package class, but top-face pressure belongs on the vacuum pen's padded cup.
• The whole habit set: on a WLCSP there is no package around the die to receive it — the edges are diced silicon that chips, the face is the die itself and cracks under point pressure, and the marking sits on active hardware. Every forgiveness the overmold silently provided is gone, and the handling must treat the component as what it is: unprotected silicon.
• Nothing — wafer-level packages are qualified to the same mechanical handling standards as molded packages, which is what makes them shippable at all.
• The tool only — bare dies are handled by vacuum pen exclusively, and the section's rule is that tweezers never touch any area-array package of any class. Metal jaws concentrate force at two points no matter how gently they close, the point-contact argument the pen's distributed cup exists to answer — and the reason production lines that mount WLCSPs by the million have never shipped a tweezer to a pick-and-place head.