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Via Repair by Rivet or Eyelet

Section 7.1 found the failed via; this section makes the first repair for a reachable one — restoring the connection through the hole by fitting a small rivet or eyelet. When a via's plated barrel has cracked, corroded, or been drilled out, the through-connection it carried is gone, and a metal rivet set in the hole can stand in for the lost plating, exactly as an eyelet restores a through-hole pad's barrel. This is a via-specific application of the eyelet repair you already know: a small hollow rivet, often sold as a via rivet, is fitted into the hole and set by swaging, its ends spread into a flare against the copper on each face so it grips the board and bridges the layers the via joined. The repair has a clear sequence — prepare the hole by reaming it to sound copper and to the rivet's size, fit and set the rivet forming its flare on each face, solder each flared end to the ring or trace it must connect, and verify both faces because a via connects through the board and must be proven face-to-face. The method has a firm limit: a rivet restores a reachable through-hole or blind via, but it cannot reach a barrel or a broken connection deep inside a multi-layer board, which is a bypass or a referral. Learn when a rivet suits a via, how to ream, fit, set, and solder it, its limit, and how to verify both faces — and the commonest via failure becomes a repair.

AdvancedMedium Risk23 min read

What You Will Learn

  • You will learn when a rivet or eyelet suits a failed via.
  • You will learn to ream and prepare a via hole for a rivet.
  • You will learn to select, size, fit, and set a rivet or eyelet in a via.
  • You will learn to solder the rivet to the connection on each face it joins.
  • You will learn the limit — when a via is beyond a rivet repair.
  • You will learn to verify a riveted via repair on both faces.

What You Will Be Able To Do

  • You will be able to judge when a rivet or eyelet suits a failed via.
  • You will be able to ream and prepare a via hole for a rivet.
  • You will be able to select, size, fit, and set a rivet or eyelet in a via.
  • You will be able to solder the rivet to the connection on each face it joins.
  • You will be able to recognize when a via is beyond a rivet repair.
  • You will be able to verify a riveted via repair on both faces.

Required Tools

  • Repair rivets or via rivets and a setting (swaging) tool
  • A reamer or fine drills matched to the hole sizes
  • Temperature-controlled soldering iron, flux, and fine solder
  • Magnifier or loupe and a bright light
  • Multimeter with continuity and low-ohms ranges
  • Isopropyl alcohol and a solder mask pen

When NOT to Attempt This

Do not attempt this section if any of the following apply to you:

  • You are not comfortable working with small surface-mount components.
  • You have not completed the prerequisite sections for this skill.
  • You do not have the required tools in working condition.

Section Overview

Section 7.1 found the failed via; this section makes the first repair for a reachable one — restoring the connection through the hole by fitting a small rivet or eyelet (§7.1). When a via's plated barrel has cracked, corroded, or been drilled out, the through-connection it carried is gone, and a metal rivet set in the hole can stand in for the lost plating, exactly as an eyelet restores a through-hole pad's barrel (§6.3; barrel). This is a via-specific application of the eyelet repair you already know: a small hollow rivet — often sold as a via rivet — is fitted into the hole and set by swaging, its ends spread into a flare against the copper on each face, so it grips the board and bridges the layers the via joined (eyelet; swaging). The repair has a clear sequence. You prepare the hole by reaming it — cleaning it back to sound copper and sizing it to the rivet — because a rivet only contacts and holds in a clean, correctly-sized hole. You fit and set the rivet, forming its flare on each face. You solder each flared end to the ring or trace it must connect, completing the electrical joint the mechanical one began. And you verify both faces, because a via connects through the board and must be proven face-to-face (§5.6). The method has a firm limit: a rivet restores a reachable through-hole or blind via, but it cannot reach a barrel or a broken connection deep inside a multi-layer board, which is a bypass or a referral (§5.5; §4.5). Learn when a rivet suits a via, how to ream, fit, set, and solder it, its limit, and how to verify both faces — and the commonest via failure becomes a repair.

Why This Matters

A rivet or eyelet is the most direct way to rebuild a failed via's connection through the board — but only within its reach, and only if the hole is prepared and the rivet soldered on every face it must join. This matters because it restores the connection at the via itself: rather than route around a failed via, a rivet rebuilds the through-connection in the original hole, which is the cleanest repair when the via is reachable (§7.1). This matters because hole preparation decides the result: a rivet grips and contacts only in a clean, correctly-sized hole, so reaming the hole to sound copper is what makes the mechanical and electrical joint sound (§6.3). It matters because the rivet must be soldered, not just set: a rivet pressed in place grips mechanically, but the reliable electrical connection is the solder joining its flared ends to the copper on each face, so soldering both ends is essential (§5.6). It matters because a via connects through the board: the repair must be verified face-to-face and to each ring, because a rivet sound on one face can be open on the other or to a layer it should serve (§5.6). And it matters because the method has a hard boundary: a rivet reaches only what surfaces, so a deep multi-layer barrel or an inner-layer connection is beyond it, and knowing that keeps you from a repair that cannot hold (§4.5). Rebuild the via where you can reach it, prepare and solder it well, and verify both faces — and a rivet makes a failed via whole again.

Required Prerequisites

  • Identifying Via Failures — Section 7.1 taught how to find a failed via and judge whether it is reachable; a rivet repair is for the reachable ones it clears.
  • Annular Ring and Through-Hole Pad Repair — Section 6.3 taught fitting an eyelet and setting it by swaging; this section applies that method to a via. This is an advanced hands-on hot-work repair section — read the Safety Notes before starting.
  • Repair rivets or via rivets in the hole sizes you meet — the parts that rebuild the through-connection (§6.3)
  • Flux and fine solder — to solder each flared end of the rivet to its ring (§5.6)
  • Isopropyl alcohol and lint-free swabs — to clean the hole and rings before fitting and soldering
  • A solder mask pen — to reseal the repaired rings and bare copper
  • Scrap boards with failed through-hole vias — to practise on; do NOT practise on any device you intend to use, sell, or return
  • A reamer or fine drill bits matched to the via hole sizes — to clean and size the hole for the rivet
  • An eyelet or rivet setting tool — to set the rivet squarely and form its flare on each face (§6.3)
  • A temperature-controlled soldering iron with a fine tip — to solder the rivet to the ring on each face (§5.3)
  • A magnifier or loupe and a bright light — to place and inspect a small rivet in a via
  • A multimeter with continuity and a low-ohms range — to verify the connection through the rivet, face-to-face (§5.6)
  • Good ventilation — to keep solder and flux fumes out of your breathing air

Real-World Applications

Repairing a via with a rivet is the standard fix for a reachable failed through-hole via, common on boards with cracked or drilled-out barrels. A technician who found a via with a cracked barrel reams the hole, sets a rivet, and solders it to the ring on each face, restoring the through-connection (§7.1). Someone whose via barrel was destroyed drilling out a seized lead fits a via rivet to rebuild both the hole and the connection (§6.3). A repairer on a corroded plated-through via cleans the hole back to sound copper by reaming before fitting the rivet. A technician facing a via whose damaged connection is on an inner layer that never surfaces recognizes it as beyond a rivet and plans a surface bypass instead (§5.5). And a repairer finishing a riveted via verifies continuity face-to-face and to each ring before trusting it (§5.6). The failures this skill prevents: fitting a rivet in an unclean or wrong-sized hole, soldering only one face, and forcing a rivet where the connection is beyond its reach.

Common Challenges

  • A poorly-prepared hole. A rivet grips and contacts badly in a dirty or wrong-sized holeream it to sound copper and to the rivet's size first (§6.3).
  • Soldering only one face. A rivet set but soldered on one side can be open on the othersolder each flared end to its ring (§5.6).
  • Forcing a rivet on deep damage. A rivet cannot reach an inner-layer connectionbypass or refer a via whose fault is buried (§5.5; §4.5).

Safety Notes

Risk Level: Medium. A via rivet repair combines reaming, rivet-setting, and soldering, so mechanical and hot-work hazards apply together, much as for a through-hole pad.

Professional Tips Before Starting

  • Size the rivet to the hole. Match the rivet and ream the hole to it before fittinga rivet only holds and contacts in the right-sized hole (§6.3).
  • Solder every face. Plan to solder the rivet to the ring on each face it must connectthe solder, not the set, makes the reliable joint (§5.6).
  • Confirm reachability first. Be sure the via and its connection surface where the rivet can reacha buried fault is a bypass, not a rivet (§5.5).

Fitting a Rivet or Eyelet to a Via

Recap and Frame

Section 7.1 ended with a decision, and where it judged a via reachable and its barrel the fault, this section makes the repair (§7.1). The frame to hold is that a rivet or eyelet rebuilds the via's through-connection by putting metal back in the hole where the barrel failed: the plated barrel carried the connection from face to face, and when it cracks or is lost, a hollow metal rivet set in the hole takes its place, gripping the board and — once soldered — carrying the connection again (barrel; §6.3). This is the same eyelet repair taught for a through-hole pad, applied to a via: the difference is only that a via's job is purely to connect layers, so the rivet must join the rings and traces the via served, on every face it reaches (annular ring). The method rests on three things. A clean, sized hole: the rivet contacts and grips only in a hole reamed to sound copper and to the rivet's diameter. A well-set rivet: fitted and swaged so its ends flare against the copper on each face. And a soldered joint: each flared end soldered to its ring, because the set grips mechanically but the solder makes the connection reliable (§5.6). Its boundary is reach: a rivet restores only what surfaces, so a via whose fault is deep in a multi-layer board is beyond it (§4.5). So this section walks when a rivet suits a via, reaming the hole, fitting and setting the rivet, soldering it, the limit, and verifying both faces. Hold the frame — metal back in the hole, gripped, soldered, and verified face-to-face — and the failed via is rebuilt.

When a Rivet or Eyelet Suits a Via

A rivet is the right repair for a specific kind of failed via, and judging the fit is the first step (§7.1). Its defining requirement is reachability: the via must be one you can ream and rivet, which means a through-hole via, open on both faces, or a blind via reachable from its one face — a via whose hole surfaces where you can work (§7.1). Its defining fault is barrel damage: a rivet is for a via whose plated barrel has cracked, corroded, or been drilled out, so that the through-connection is gone but the hole and the rings on the faces remain (barrel; §6.3). For that combination — reachable hole, failed barrel, sound rings — a rivet is ideal: it rebuilds exactly what was lost, the metal path through the hole. Judge the rings too: the rivet must solder to a ring on each face, so if a ring is also torn away, it is rebuilt first as a through-hole pad before the rivet goes in (§6.3). Know where the method stops. A buried via or a microvia does not surface and cannot be reamed or riveted (§7.1). And a via whose broken connection is on an inner layer — where the barrel meets an inner plane, say — cannot be restored by a rivet that contacts only the outer faces, however sound the outer connection. In those cases the repair is a surface bypass between accessible points, or a referral (§5.5; §4.5). Match the method to the via — reachable hole and failed barrel for a rivet, buried or inner-layer for a bypass or referral — and you commit only to repairs a rivet can make. Choose the rivet for the via it fits, and the repair starts from solid ground.

Preparing the Hole by Reaming

A rivet holds and conducts only in a clean, correctly-sized hole, so preparing the hole by reaming is the step the whole repair depends on. Reaming means cleaning and sizing the hole: running a reamer or a fine drill through the via to clear away the cracked or corroded remains of the old barrel, any debris, and any oxidation, back to sound copper on the hole wall and the rings (barrel). Size the hole to the rivet: ream to the diameter the chosen rivet needs — snug enough that the rivet seats and grips, not so loose that it rattles nor so tight that forcing it splits the hole — so match the reamer or drill to the rivet before you start (§6.3). Work gently and squarely: a via hole is small and its rings are delicate, so ream slowly and straight, because a reamer forced or angled can enlarge the hole, tear a ring, or damage the board around it. Clean after reaming: wipe the hole and the rings with isopropyl alcohol to remove dust and debris, so the rivet seats cleanly and the solder will wet. Expose and check the rings: confirm a sound, solderable ring on each face the rivet must connect to, and rebuild a torn one first if needed (annular ring; §6.3). Judge the result: a hole reamed clean and to size, with sound rings, is ready for a rivet; a hole left dirty, oversized, or with torn rings is not. Ream the hole clean, straight, and to size, and the rivet has a sound seat to grip and a clean ring to join.

Fitting and Setting the Rivet

With the hole prepared, the rivet is fitted and set, forming the flare that grips the board — the same swaging you know, at via scale (§6.3). Select the rivet: choose a via rivet or eyelet whose diameter matches the reamed hole and whose length suits the board's thickness, so it seats fully with enough rim to flare on each face (eyelet). Fit it into the hole: slip the rivet through the reamed via so it seats flat against the ring, square to the board, not tilted. Set it by swaging: with the setting tool, press and roll the rivet's ends outward against the ring on each face, forming a flare — the spread, rolled-over rim that grips the board mechanically and presses the rivet into contact with the ring (swaging). Set it in one controlled action: a rivet set squarely and fully in a single press seats best, while one set crooked or under-pressed grips and contacts poorly and may need to be removed and replaced. Check the set: both flares should sit flat and even against their rings, the rivet tight in the hole with no wobble, seated square to the board. Support the far side: setting a rivet presses on the board, so back the board on a firm, flat surface or the tool's anvil so the far ring is supported and not bent as the near end is flared. A rivet seated square, set in one press, and flared flat on each face is mechanically in place — gripping the board and touching each ring, and ready to be soldered. Set the rivet squarely and flare it flat on both faces, and the mechanical half of the repair is done.

Soldering the Connection

A set rivet grips the board, but the reliable electrical connection is made by soldering its flared ends to the rings, so this step turns a mechanical fit into a sound joint (§5.6). Solder each flared end to its ring: with a fluxed, fine-tipped iron, heat the flare and its ring together and flow a little solder so it wets both into one shiny joint, on every face the rivet must connect to (§5.3). Solder every connecting face: a through-hole via joins the top face to the bottom, so both flares are soldered; where the rivet also meets an inner-layer ring exposed at the hole, its connection is made by the solder wicking into the hole, though a connection deep inside that the solder cannot reach is beyond this repair (§4.5). Wet the flare and the ring as one: the goal is a fillet that joins the rivet to the ring, not a blob sitting on top, so let the solder flow into the junction between them. Keep the heat brief: the rings are delicate and freshly reamed, so a quick, hot joint avoids lifting them, and heat-sinking or working fast protects a nearby ring or part (§4.3; §5.3). Confirm each joint: each soldered flare should be shiny and well-wetted to its ring, with no cold graininess and no bridge to a neighbouring pad or trace. Reflect on the limit as you solder: if the via should connect a layer whose ring you cannot reach or solder, the rivet alone will not restore that layer, and the connection needs a bypass (§5.5). A rivet soldered to a sound, shiny joint on each face it must connect carries the via's connection again. Solder every face the via joins, briefly and cleanly, and the rivet's mechanical grip becomes a reliable electrical connection.

The Limit and Verifying Both Faces

A riveted via is proven, like every via repair, through the board and on both faces — and this is also where the method's limit is finally weighed (§5.6). Verify the through-connection first: measure continuity and resistance face-to-face through the rivet, confirming the connection from the ring on one face to the ring on the other is restored, near the value of a known-good via (§7.1). Verify each ring to its trace: confirm the rivet's connection reaches the trace on each face it should serve, so the via is joined into the circuit on every layer it connects, not just mechanically filled (annular ring). Check for shorts: confirm the rivet and its solder touch only the rings they should and not a neighbouring pad or trace. Test it mechanically: the rivet should be tight and its flares soldered flat, so a gentle nudge moves nothing (§7.4). Weigh the limit honestly: if verification shows an inner-layer connection still open — the rivet restored the outer faces but not a buried layer — then a rivet was not enough, and the layer needs a bypass or the board a referral (§5.5; §4.5). Protect the repair: reseal the rings and bare copper on each face with a solder mask pen once verified. A riveted via that carries continuity face-to-face and to each trace, holds mechanically, and shorts to nothing is a finished repair; one still open through the board or to a layer is not — bypass or refer what the rivet could not reach. Verify both faces and through the hole, and the rivet either proves the via whole or shows you it needed more.

Common Mistakes

  • Riveting a dirty or wrong-sized hole. A rivet grips and conducts badly in an unclean or mis-sized holeream to sound copper and to the rivet's size first.
  • Setting the rivet crooked. A tilted or under-set rivet contacts and grips poorlyseat it square and set it in one controlled press.
  • Soldering only one face. A rivet joined on one side can be open on the othersolder each flared end to its ring (§5.6).
  • Forcing a rivet on a buried fault. A rivet cannot reach an inner-layer connectionbypass or refer it (§5.5; §4.5).
  • Overheating a fresh ring. A just-reamed ring lifts easily under heatsolder briefly and heat-sink where needed (§4.3).

Troubleshooting Guidance

Rivet-repair problems come down to a rivet that will not seat, will not connect, or cannot reach. If the rivet is loose in the hole: the hole is over-reamed or the rivet too small — fit a larger rivet or a fresh hole size. If the rivet will not seat square: the hole is not clean or straight — re-ream it gently and true. If a face reads open after soldering: the flare is not soldered to that ring — reflow the joint on that face (§5.6). If the via reads open through the hole: the rivet is not making the face-to-face connection — check both flares are set and soldered. If a ring lifts while soldering: you are overheating a fresh ring — solder faster, cooler, and heat-sink (§4.3). If a neighbour is shorted: solder has bridged — wick it clear and re-inspect. If an inner layer is still open: the rivet cannot reach it — the layer needs a surface bypass (§5.5). If the via cannot be reamed or reached: it is buried or a microvia — bypass or refer (§4.5). The throughline: ream clean and to size, set square, solder every face, and verify face-to-face — and bypass what a rivet cannot reach.

Verification & Testing Methods

Confirm the riveted via on both faces and through the board before trusting it:

  • [ ] I prepared the hole by reaming it clean, straight, and to the rivet's size, with sound rings on each face (§6.3).
  • [ ] I fitted the rivet square and set it by swaging, forming a flat flare on each face (§6.3).
  • [ ] I soldered each flared end to its ring on every face the via must connect, briefly and cleanly (§5.3).
  • [ ] I verified continuity and resistance face-to-face through the rivet and each ring to its trace, near a known-good via (§7.1).
  • [ ] I confirmed no short, tested the rivet mechanically, and referred or bypassed any inner-layer connection the rivet could not reach (§5.5; §4.5).

Then try the practice exercises below — hands-on repair practice on scrap boards; scenarios differ from the quiz.

Practice Exercises

  1. Ream a via (6 minutes, hands-on). On a scrap board, ream a failed through-hole via clean and to the size of a chosen rivet, keeping the rings sound (§6.3).
  2. Set a rivet (7 minutes, hands-on). Fit the rivet square, set it by swaging so it flares flat on each face, and check it is tight and seated.
  3. Solder both faces (7 minutes, hands-on). Solder each flared end to its ring with a fluxed fine iron, keeping the heat brief, then inspect each joint (§5.3).
  4. Verify face-to-face (5 minutes, hands-on). Measure continuity and resistance through the rivet from face to face and to each trace, comparing to a known-good via (§7.1).

These core ideas — when a rivet suits a via, reaming the hole, setting the rivet, soldering both faces, the limit, and verifying face-to-face — are tested in the Chapter Quiz at the end of this chapter, where a score of 80% is required to continue.

Key Takeaways

  • A rivet or eyelet rebuilds a reachable failed via by putting metal back in the hole where the barrel failed, gripping the board and — once soldered — carrying the connection face-to-face (§6.3; barrel).
  • Prepare the hole by reaming it clean, straight, and to the rivet's size, because a rivet seats, grips, and conducts only in a correctly-prepared hole.
  • Set the rivet square by swaging so it forms a flat flare against the ring on each face, then solder each flared end to its ring, because the solder, not the set, makes the reliable joint (§5.6).
  • A rivet reaches only what surfaces: a barrel or connection deep in a multi-layer board, or a buried via, is beyond it and needs a surface bypass or a referral (§5.5; §4.5).
  • Verify a riveted via through the board and on both faces — continuity face-to-face and to each trace, near a known-good via — and bypass or refer any layer the rivet could not reach (§7.1).

Skills Learned

  • You can now judge when a rivet or eyelet suits a failed via.
  • You can now ream and prepare a via hole for a rivet.
  • You can now select, size, fit, and set a rivet or eyelet in a via.
  • You can now solder the rivet to the connection on each face it joins.
  • You can now recognize when a via is beyond a rivet repair.
  • You can now verify a riveted via repair on both faces.

Glossary Additions

  • reaming — cleaning and sizing a drilled hole, such as a via, by running a reamer or a fine drill through it to clear away debris, corrosion, and the remains of a cracked or lost plated barrel, back to sound copper, and to bring the hole to the diameter a repair rivet or eyelet needs. Reaming is the preparation a rivet repair depends on: a rivet seats, grips, and conducts only in a hole that is clean and correctly sized, so a hole is reamed — slowly and squarely, to avoid enlarging it or tearing the delicate rings — before a rivet is fitted. A hole reamed too large leaves a loose rivet, and one reamed off-square or forced can split the hole or lift a ring.
  • flare — the spread, rolled-over rim formed on each end of a rivet or eyelet when it is set by swaging, which grips the board mechanically and presses the rivet into contact with the pad or annular ring on each face. The flare is what turns a loose rivet sitting in a hole into a secured through-connection: a setting tool rolls each end outward into a flat flare against its ring, and that flare, once soldered to the ring, both holds the rivet and carries the connection. A flare that is even and flat on each face indicates a well-set rivet, while a partial, tilted, or uneven flare signals a poor set that grips and contacts badly.

Suggested Next Sections

Must read next:

  • Via Repair by Wire or Fill — Section 7.3 takes up the vias a rivet does not suit: restoring the connection with a wire run through the hole and soldered to each face, or a conductive fill, for vias too small, too damaged, or awkwardly placed for a rivet.

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